Developed by the MIPI Alliance ( MIPI CSI-2 defines an interface between an image sensor module and a host processor such as a System on Chip (SoC) and suits single or multi-sensor embedded vision applications. Perhaps more than any other camera interface, MIPI Camera Serial Interface 2 (MIPI CSI-2) provides point-to-point image and video transmission for mobile and embedded vision applications. It was founded in 2001 in Fuzhou, and employ around 700 employees. Rockchip offers SoC (System-on-Chip) for tablets, notebooks, IPTV/OTT-Boxes, intelligent video applications in smartphones, drones, robotics and other smart devices.MIPI CSI-2 Camera Interface for Next-Generation Embedded Apps In fact, it stands behind many new wins of CEVA’s imaging technology. Rockchip is considered China’s leading fabless semiconductor company and has been honored with China Chip Awards for 10 times. Rockchip is an interesting partner in this project.
“There is a clear demand for cost-efficient 3D camera sensor modules to enable an enriched user experience for smartphones, AR and VR devices and to provide a robust localization and mapping (SLAM) solution for robots and autonomous cars,” said Shin Yun-sup, principal engineer at LG Electronics. CEVA said that teams from CEVA, Rockchip and LG worked closely together to optimize LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimized algorithm libraries to ensure optimal performance under stringent power constraints. The camera 3D sensing applications include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection and AR and VR. With LG design win, the cooperation between CEVA and Rockchip is becoming an allianceĪpple will no longer be alone in the market of 3D camera for face authentication and gesture recognition in smartphones: CEVA and LG Electronics announced today a partnership to deliver high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications. The 3D camera module incorporates the RK1608 coprocessor of the Chineze fabless Rockchip with multiple CEVA-XM4 imaging and vision DSPs.
On August 2016, Rockchip has licensed the CEVA-XM4 imaging and vision DSP to enhance the imaging and computer vision capabilities of its SoC product lines. Rockchip and CEVA won LG Design for 3D Camera
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